Bambu Lab H2C With AMS
Bambu Lab H2C
Bambu Lab H2C Full Laser Combo 10W/40W
Product Features
- Vortek quick-swap nozzle system for fast, automatic multi-material printing
- Rapid nozzle heat-up in as fast as 8 seconds with wireless power/data transfer
- Fully enclosed active heated chamber for improved high-temperature material performance
- Multi-filament support with AMS compatibility for up to 24 materials
- Quad-camera computer vision system for print monitoring and quality assurance
- 59 integrated sensors providing real-time diagnostics and print reliability
- High-temperature capable hotend for engineering-grade materials
- Reduced purge waste via dedicated nozzle-per-material workflow
Fully Automatic Filament Change
Always Delivering the Most Efficient Combination
Bambu Lab H2C - Technical Specifications
Printing Technology
| Fused Deposition Modeling |
Body
| Build Volume (W*D*H) |
Single Nozzle Printing (Left): 325*320*325 mm³ Single Nozzle Printing (Right): 305*320*325 mm³ Dual Nozzle Printing: 300*320*325 mm³ Total Volume for Two Nozzles: 330*320*325 mm³ |
| Chassis | Aluminum and Steel |
| Outer Frame | Plastic and Glass |
Physical Dimensions
| Physical Dimensions | 492*514*626 mm³ |
| Net Weight | 32.5 kg |
Toolhead
| Extruder Gear | Hardened Steel |
| Nozzle | Hardened Steel |
| Max Nozzle Temperature | 350 ℃ |
| Supported Nozzle Diameter | 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm |
| Filament Cutter | Built-in |
| Filament Diameter | 1.75 mm |
| Extruder Motor | Bambu Lab High-precision Permanent Magnet Synchronous Motor |
Heatbed
| Build Plate Material | Flexible Steel Plate |
| Included Build Plate Type | Textured PEI Plate |
| Supported Build Plate Type | Textured PEI Plate, Engineering Plate |
| Max Heatbed Temperature | 120 ℃ |
Speed
| Max Speed of Toolhead | 1000 mm/s |
| Max Acceleration of Toolhead | 20,000 mm/s² |
| Max Flow for Hotend | 40 mm³/s (Test parameters: 250 mm round model with a single outer wall; Bambu Lab ABS; 280 ℃ printing temperature) |
Chamber Temperature Control
| Active Chamber Heating | Supported |
| Max Chamber Temperature | 65 ℃ |
Air Purification
| Pre-filter Grade | G3 |
| HEPA Filter Grade | H12 |
| Activated Carbon Filter Type | Granulated Coconut Shell |
| VOC Filtration | Superior |
| Particulate Matter Filtration | Supported |
Cooling
| Part Cooling Fan | Closed Loop Control |
| Cooling Fan for Hotend | Closed Loop Control |
| Main Control Board Fan | Closed Loop Control |
| Chamber Exhaust Fan | Closed Loop Control |
| Chamber Heat Circulation Fan | Closed Loop Control |
| Auxiliary Part Cooling Fan | Closed Loop Control |
| Toolhead Enhanced Cooling Fan | Closed Loop Control |
Supported Filament Type
| Standard Materials | PLA, PETG, TPU, PVA, BVOH, ABS, ASA, PC, PA, PET, PPS |
| Reinforced Materials | Carbon/Glass Fiber Reinforced PLA, PETG, PA, PET, PC, ABS, ASA, PPA, PPS |
Sensor
| Live View Camera | Built-in; 1920*1080 |
| Nozzle Camera | Built-in; 1920*1080 |
| BirdsEye Camera | Built-in; 3264*2448 (Equipped with Laser Edition) |
| Toolhead Camera | Built-in; 1600*1200 |
| Door Sensor | Supported |
| Filament Run Out Sensor | Supported |
| Filament Tangle Sensor | Supported |
| Filament Odometry | Supported with AMS |
| Power Loss Recovery | Supported |
Electrical Requirements
| Voltage | 100–120 VAC / 200–240 VAC, 50/60 Hz |
| Max Power* | 1800 W@220 V / 1250 W@110 V |
| Typical Power | 200 W@220 V / 200 W@110 V (Single Nozzle Printing PLA) |
Working Environment
| Working Temperature | 10 ℃–30 ℃ |
Electronics
| Touchscreen | 5-inch 720*1280 Touchscreen |
| Storage | Built-in 8 GB EMMC and USB Port |
| Control Interface | Touchscreen, mobile App, PC App |
| Motion Controller | Dual-core Cortex-M4 and Single-core Cortex-M7 |
| Application Processor | Quad-core ARM with NPU |
Software
| Slicer & Software |
Bambu Studio. Supports third-party slicers that export standard G-code (e.g., SuperSlicer, PrusaSlicer, Cura); certain advanced features may not be supported. |
| Supported Operating System | MacOS, Windows, Linux |
Network Control
| Ethernet | Not Available |
| Wireless Network | Wi-Fi |
| Network Kill Switch | Not Available |
| Removable Network Module | Not Available |
| 802.1X Network Access Control | Not Available |
Wi-Fi
| Operating Frequency | 2412–2472 MHz, 5150–5850 MHz (FCC/CE); 2400–2483.5 MHz, 5150–5850 MHz (SRRC) |
| Wi-Fi Transmitter Power (EIRP) |
2.4 GHz: <23 dBm (FCC); <20 dBm (CE/SRRC/MIC) — 5 GHz Band1/2: <23 dBm (FCC/CE/SRRC/MIC); Band3: <30 dBm (CE) / <24 dBm (FCC); Band4: <23 dBm (FCC/SRRC) / <14 dBm (CE) |
| Wi-Fi Protocol | IEEE 802.11 a/b/g/n |
* To ensure the heatbed quickly reaches the needed temperature, the printer will maintain maximum power for about 3–5 minutes.